Process Engineer at Central Employment

Job Description:

Latest job information from Central Employment for the position of Process Engineer. If the Process Engineer vacancy in Sedgefield matches your qualifications, please submit your latest application or CV directly through the updated Jobkos job portal.

Please note that applying for a job may not always be easy, as new candidates must meet certain qualifications and requirements set by the company. We hope the career opportunity at Central Employment for the position of Process Engineer below matches your qualifications.

Process Engineer

Location: Sedgefield

A leading organisation at the forefront of microwave and millimetre wave technology is expanding its advanced packaging and assembly capability. With a strong focus on innovation, high performance manufacturing and next generation RF solutions, the business is growing its Process Engineering team to support the industrialisation of emerging technologies.

This is an excellent opportunity for an experienced Process Engineer to join a high precision manufacturing environment and contribute to the successful transition of new semiconductor and RF module assembly technologies into stable, scalable and high yield production.

Role Description

The Process Engineer will evaluate, develop, optimise and control semiconductor and RF module assembly processes, with a particular focus on die attach technologies including silver epoxy, silver sinter and eutectic attach, along with gold wire and ribbon bonding.

Working in close collaboration with RF Engineering, the role will support the identification, assessment and advancement of future manufacturing technologies. This ensures that emerging product designs remain manufacturable, reliable and aligned with long term technical objectives.

The successful candidate will take responsibility for process robustness, manufacturability, yield improvement and cost efficiency while supporting all elements of new product introduction.

Key Responsibilities

Technology and Roadmap Support

• Collaborate with RF Engineering to identify suitable materials, processes and assembly methods that align with future product requirements.

• Evaluate emerging die attach and interconnect technologies that enable higher frequency operation, improved thermal performance and increased power density.

• Provide early manufacturability guidance during technology planning.

• Assess scalability, automation potential and cost implications.

• Lead feasibility trials and proof of concept builds.

• Support supplier capability reviews and make or buy considerations.

Die Attach Process Development

• Evaluate and optimise die attach processes, including silver epoxy, silver sinter and eutectic attach.

• Define process windows for temperature, pressure, time and atmosphere.

• Create qualification plans and validation methodologies.

• Conduct thermal, mechanical and reliability assessments.

• Characterise voiding, bond line thickness, shear strength and thermal resistance.

• Support material selection and supplier evaluation.

Wire Bonding Process Development and Optimisation

• Develop and optimise gold ball and wedge bonding processes.

• Establish bonding parameters for a range of metallisation and substrate types.

• Conduct pull and shear testing with reliability validation.

• Address challenges related to intermetallic formation, pad damage and bond integrity.

• Support development towards fine pitch and high frequency capable bonding.

Manufacturing Process Development

• Define, document and control new and existing manufacturing processes.

• Develop process flows, standard operating procedures and control plans.

• Implement statistical process control and yield monitoring using Cp and Cpk analysis.

• Lead root cause investigations using structured methodologies such as 8D, DMAIC and FMEA.

• Deliver continuous improvement for yield, cycle time and cost efficiency.

New Product Introduction

• Lead design for manufacture and design for assembly reviews.

• Support prototype and pilot builds with robust validation plans.

• Work closely with RF, mechanical, quality and operations teams to ensure manufacturability.

• Define tooling, fixturing and automation requirements.

Essential Requirements

• Degree in Engineering, Materials Science, Physics or a related field.

• Experience within semiconductor or RF module assembly processes.

• Practical experience with one or more of the following processes: silver epoxy die attach, silver sintering, eutectic die attach and gold wire bonding.

• Understanding of materials behaviour, intermetallic formation and thermal management.

• Experience with process validation and statistical analysis tools.

• Strong problem solving capability within a manufacturing environment.

• Methodical, analytical and confident working across both development engineering and production operations.

• Proactive, hands on and effective within a fast paced and scaling organisation.

• Strong mechanical reasoning and cross functional collaboration skills.

Desirable Criteria

• Experience in high precision automotive electronics or power electronics with a strong focus on automation, process stability and a zero defect culture.

• Background in semiconductor, electronics or high technology manufacturing.

• Experience with equipment specification, procurement and commissioning.

• Knowledge of RF packaging requirements and JEDEC standards.

• Experience with thermomechanical modelling and material reliability testing.

• Previous experience within RF electronic production or contract electronics manufacturing.

• Knowledge of IATF 16949 or ISO 9001, with training available as required.

Job Info:

• Company: Central Employment
• Position: Process Engineer
• Work Location: Sedgefield
• Country: GB

How to Submit an Application:

After reading and understanding the criteria and minimum qualification requirements explained in the job information Process Engineer at the office Sedgefield above, immediately complete the job application files such as a job application letter, CV, photocopy of diploma, transcript, and other supplements as explained above. Submit via the Next Page link below.